Category: 18 Layers High Density Interconnect PCB
Board Thickness: 2.8mm
Copper Thickness: 18um 35um
Solder Mask Color: Green
Minimum Line Width / Line Spacing: 0.125 / 0.125mm
Minimum Hole:0.075mm
Finished Surface Process:ENIG
Interconnection mode: L1-2 L2-3 L3-4 L5-10 L11-14 L15-16 L16-17 L17-18
Category: 18 Layers High Density Interconnect PCB
Board Thickness: 2.8mm
Copper Thickness: 18um 35um
Solder Mask Color: Green
Minimum Line Width / Line Spacing: 0.125 / 0.125mm
Minimum Hole:0.075mm
Finished Surface Process:ENIG
Interconnection mode: L1-2 L2-3 L3-4 L5-10 L11-14 L15-16 L16-17 L17-18
Category: 18 Layers High Density Interconnect PCB
Board Thickness: 2.8mm
Copper Thickness: 18um 35um
Solder Mask Color: Green
Minimum Line Width / Line Spacing: 0.125 / 0.125mm
Minimum Hole:0.075mm
Finished Surface Process:ENIG
Interconnection mode: L1-2 L2-3 L3-4 L5-10 L11-14 L15-16 L16-17 L17-18