● PCB plant in Shenzhen and Jiangxi city
● FPC plant in Shandong Province
● 1~26 layers from Sample to Mass Production
● PCB/HDI/FPC/Rigid-flex PCB/Metal PCB etc.
● Engineers average over 15 years experience
● International certifications
● Guarantee quality
● Quick-turn service
● 24H Quick-turn service
● Design for manufacturability
● TPS Quality Control System
|
Sample |
Volume |
Layer |
1-26 L |
1-26 L |
Finished thickness |
0.2-17.5mm |
0.2-10mm |
Min hole |
0.1mm |
0.2mm |
Min laser hole |
3mil |
4mil |
HDI Type |
1+n+1、2+n+2、3+n+3 |
1+n+1、2+n+2 |
Min Spacing |
3/3mil |
4/4mil |
Impedance control |
+/-5% |
+/-10% |
Max copper thickness |
12oz |
6oz |
Max board size |
650mm X 1130mm |
610mm X 1100mm |
Materials |
FR4/Hi-Tg/Rogers/Halogen Free/ |
|
Surface treatment |
HASL、HASL PB FREE |
|
Special Processing |
Buried blind holes, step grooves, metal substrates, buried resistors, buried capacitors, mixing, hard and soft combination, back drills, step golden fingers, etc. |
Layers |
Sample |
Volume |
Quick-turn |
1L |
3 day |
6 days |
1 day |
2L |
3 days |
6 days |
1 day |
4L |
5 days |
8 days |
2 days |
6L |
6 days |
10 days |
3 days |
8L |
7 days |
12 days |
4 days |
10L |
8 days |
12 days |
5 days |
12L |
9 days |
14 days |
5 days |
14L |
10 days |
16 days |
6 days |
16L |
11 days |
18 days |
7 days |
18L |
12 days |
20 days |
8 days |
20L |
13 days |
22 days |
9 days |
22L |
13 days |
22 days |
9 days |
24L |
15 days |
26 days |
11 days |
26L |
16 days |
28 days |
12 days |
Category: 4 Layers Step-hole PCB Board Thickness: 2.0mm Copper Thickness: 35um Minimum Spacing: 0.3 / 0.3mm Minimum Hole: 0.3mm Finished Surface Process:ENIG Step-hole : 0.6mm
Category: 6 Layers Rigid-flex PCB Rigid Board Thickness: 1.6mm Flexible Board Thickness: 0.125mm Copper Thickness: 35/35/25/25/35/35um Solder Mask Color: Green Cover Film Color: Yellow Minimum Line Width / Line Spacing: 0.13 / 0.13mm Minimum Hole: 0.15mm Finished Surface Process:ENIG
Layer: 6 Layers Rogers+FR-4 Mixed Dielectric PCB Finished Thickness: 1.6mm Copper Thickness: 35um Solder Mask Color: Green Minimum Spacing: 0.1 / 0.1mm
Category: 8 Layers BGA PCB Finished Thickness: 2.0mm Copper Thickness: 35um Solder Mask Color: Blue Minimum Line Width / Line Spacing: 0.12 / 0.12mm Finished Surface Process:ENIG BGA Size:0.25mm
Category: 8 Layers Thick PCB Board Thickness: 7.6mm Material: FR-4 Copper Thickness: Inner layer 18um outer layer 35um Solder Mask Color: Green Minimum Line Width / Line Spacing: 0.15 / 0.15mm Minimum Hole: 0.5mm Finished Surface Process: ENIG
Category: 18 Layers High Density Interconnect PCB Board Thickness: 2.8mm Copper Thickness: 18um 35um Solder Mask Color: Green Minimum Line Width / Line Spacing: 0.125 / 0.125mm Minimum Hole:0.075mm Finished Surface Process:ENIG Interconnection mode: L1-2 L2-3 L3-4 L5-10 L11-14 L15-16 L16-17 L17-18