SMT workshop of ShenZhen PCB ELECTRONICS LTD has central air condition system，dust-free room，anti-static protection，constant temperature and humidity warehouse etc.World-class Samsung SMT machine，full-automatic solder paste printing machine，12 temperature range reflow oven and wave oevn， AOI/SPI/X-RAY/Intelligent first-sample tester. More equipment >>
There are 10 SMT lines,including imported Samsung brand SMT machine,automatic solder paste printing machine,12-temperature-range reflow oven,AOI inspection,X-ray inspection,and other high-end equipments.Daily capacity over 10 million solder joints,especially focus on high-precision，sophisticated projects.
SMT capacity |
10 million solder joints / day |
Production line |
10 lines |
Scrap rate |
0.3% for capacitors/resistors |
0% for IC |
|
PCB type |
POP/PCB/FPC/Regid-lfex PCB/Metal PCB |
Components |
Minimum package |
03015 |
Components accuracy |
±0.4mm |
|
IC accuracy |
±0.3mm |
|
PCB |
PCB dimension |
50*50—774*710mm |
PCB thickness |
0.2—7.5mm |
SMT quality control:
* Production lines are equipped with high-end , high precision and high yield machine
* Quality inspection and control are carried out in each process to avoid defective products go out
* Professional engineers l for the whole process sampling inspection
①Sticking board: check if SMT mounting position of components are correct, greatly reduce SMT trial production time and waste of components, effectively ensure the quality of SMT
②Intelligent first-sample tester: wrong components, ,reverse polarity, reverse direction etc., compared with visual inspection, accuracy is higher 50%
③SPI-fully automatic 3D solder paste thickness measuring intrument: check printing quality problems, such as missing print, less tin, more tin, tin bridge, tin offset, poor shape, surface stuff etc.
④AOI：check short ,miss, polarity, offset, wrong parts
⑤Xray: Open-circuit and short-circuit inspection of BGA, QFN and other issues
Category: 4 Layers Step-hole PCB Board Thickness: 2.0mm Copper Thickness: 35um Minimum Spacing: 0.3 / 0.3mm Minimum Hole: 0.3mm Finished Surface Process：ENIG Step-hole : 0.6mm
Category: 6 Layers Rigid-flex PCB Rigid Board Thickness: 1.6mm Flexible Board Thickness: 0.125mm Copper Thickness: 35/35/25/25/35/35um Solder Mask Color: Green Cover Film Color: Yellow Minimum Line Width / Line Spacing: 0.13 / 0.13mm Minimum Hole: 0.15mm Finished Surface Process：ENIG
Layer: 6 Layers Rogers+FR-4 Mixed Dielectric PCB Finished Thickness: 1.6mm Copper Thickness: 35um Solder Mask Color: Green Minimum Spacing: 0.1 / 0.1mm
Category: 8 Layers BGA PCB Finished Thickness: 2.0mm Copper Thickness: 35um Solder Mask Color: Blue Minimum Line Width / Line Spacing: 0.12 / 0.12mm Finished Surface Process：ENIG BGA Size：0.25mm
Category: 8 Layers Thick PCB Board Thickness: 7.6mm Material: FR-4 Copper Thickness: Inner layer 18um outer layer 35um Solder Mask Color: Green Minimum Line Width / Line Spacing: 0.15 / 0.15mm Minimum Hole： 0.5mm Finished Surface Process: ENIG
Category: 18 Layers High Density Interconnect PCB Board Thickness: 2.8mm Copper Thickness: 18um 35um Solder Mask Color: Green Minimum Line Width / Line Spacing: 0.125 / 0.125mm Minimum Hole：0.075mm Finished Surface Process：ENIG Interconnection mode: L1-2 L2-3 L3-4 L5-10 L11-14 L15-16 L16-17 L17-18
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