Global PCB Segmentation Product Structure
With the rapid development of technology in the world's electronic circuit industry, the integrated applications of components are becoming more and more widely used, and the high-density requirements of electronic products for PCB are more prominent. In the future, high-end PCB products such as multi-layer boards, HDI, and IC substrates demand will become increasingly significant. Electronic products will continue to develop in the direction of "integration, automation, miniaturization, lightweight, and low energy consumption", which will promote the continuous development of PCB in the direction of high density, high speed and high frequency, high heat dissipation, light and thin, and miniaturization. The demand such as Rigid-Flexible boards, HDI, Substrate-Like PCB(SLP), and packaging substrates will increase day by day. From the perspective of PCB product subdivision structure, in 2021, multilayer boards account for 38.6% of the global PCB subdivision products, packaging substrates account for 17.6%, FPC account for 17.5%, and HDI account for 14.7%. The proportion of single-side and double-sides PCB is 11.6%.