Why does bridging occur?
Bridging refers to the abnormal connection of solder between conductors, and solder bridges to adjacent non-conductors or components. When the PCB goes through the reflow soldering process, if the temperature rises too fast, the solvent inside the solder paste will volatilize, causing the solvent to boil and splash, which will form the bridging. Or due to excessive solder paste due to the thickness of the stencil and the large via size, bridging will also be formed after reflow soldering. If the pressure of the squeegee is too high, the printed solder paste will collapse and bridging will also occur. Solder paste printing misalignment and other reasons will also cause bridging phenomenon.