What is HDI circuit board?
In PCB manufacturing, HDI (High-Density Interconnect) PCBs represent a significant technology. HDI PCBs employ high-density interconnection techniques to achieve more electronic components and connections within limited space. This technology aims to enhance the wiring density and performance of Printed Circuit Boards (PCBs) to meet the modern electronic devices' demands for smaller sizes, lighter weights, and higher performance.
HDI PCBs introduce more layers, smaller vias, and tighter layouts into traditional PCB designs. This enables HDI PCBs to accommodate more components and connections within relatively small dimensions, achieving higher functional integration and performance. This is often achieved through the use of micro-traces, micro-vias, and high-density interconnection techniques.
HDI PCBs are commonly categorized into the following types:
1. 1+N+1 HDI: In this type of HDI PCB, there are standard board layers on both sides with multiple non-conductive layers in between. This approach increases the connection density and allows more components to be accommodated in a smaller space.
2. 2+N+2 HDI: Similar to 1+N+1, this type of HDI PCB features even higher interconnection density. It includes two standard board layers and additional non-conductive layers in between.
3. 3+N+3 HDI: This represents a higher level of HDI design with more layers and increased connection density. It suits complex circuits and high-performance applications.
The design and manufacturing of HDI PCBs demand higher technical precision. Due to the tighter arrangement of components and traces, wiring becomes more challenging. Advanced manufacturing techniques such as laser drilling, etching, and thin film deposition are also required.
In conclusion, HDI PCBs are an advanced technology used to achieve higher-density connections within limited space. They play a significant role in modern electronic devices by enabling more functionality to be integrated into smaller sizes.