Description: 8L Ultra-Thick Banking System Motherboard, PCB Manufacturing
| Layer | 8L | Material | FR-4 TG170 |
|---|---|---|---|
| Material Thckness | 7.6mm | Finished Copper Thickness | 1/1/1/1/1/1/1/1oz |
| Solder Mask Type/Color | Green | Unit Size | 154*78mm |
| Special Item | Ultra Thick | Surface Finishing | ENIG 3U" |
| Min Via | 0.5mm | Min Line/Track Space | 4/4mil |