Category: PCB
Industry Area: Banking System
Layer Count: 8L
Material: FR4 TG170
Product parameters
Description: 8L Ultra-Thick Banking System Motherboard, PCB Manufacturing

Layer8LMaterialFR-4 TG170
Material Thckness7.6mmFinished Copper Thickness1/1/1/1/1/1/1/1oz
Solder Mask Type/ColorGreenUnit Size154*78mm
Special ItemUltra ThickSurface FinishingENIG 3U"
Min Via0.5mmMin Line/Track Space4/4mil

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