Description: FPGA Module Circuit Board PCB Assembly and Manufacturing, FPGA Development Board Prototyping and Production, One-stop OEM/ODM Service Provider for FPGA Boards
| Layer | 6L | Material Thickness | 1.6mm |
|---|---|---|---|
| Surface Finishing | ENIG:1u" | Finished Copper Thickness | 1/1/1/1/1/1OZ |
| Solder Mask | Matte Black | Legend Mark | white |
| Material | FR-4 TG130 | Test | Electrical Test |
| Special Process | Gold Fingers | Routed OutLine/Punching | CNC+V-cut |
